AIROC™ CYW20820 Bluetooth® & Bluetooth® LE SoC
For IoT Applications
Robust connectivity with -94.5 receive sensitivity, 11.5 transmit LE output power providing 106db link budget
The AIROC™ CYW20820 Bluetooth® & Bluetooth® LE SoC is a Bluetooth® 5.2 core spec compliant device for IoT applications. Manufactured using the industry's advanced 40nm CMOS low-power process, the CYW20820 is a highly integrated device which delivers up to 11.5 dBm transmit output power in LE and BR modes and up to 2.5 dBm in EDR mode, reducing the device footprint and the costs associated with implementing Bluetooth® solutions.
The AIROC™ CYW20820 Bluetooth® & Bluetooth® LE SoC is designed to support a wide spectrum of Bluetooth® use cases for home automation, sensors (medical, home, security, and industrial), lighting, or any Bluetooth® connected IoT application.
- Bluetooth® 5.2 core spec compliant with LE 2 Mbps
- Supports Basic Rate, Enhanced Data Rate, and Bluetooth® Low Energy
- -94.5dBm Rx sensitivity
- 11.5 dBm Tx LE, 11.5dbM Tx BR and 2.5 dbM Tx EDR
- 176KB RAM and 256 KB flash memory optimized for data transfer use cases
- 96 MHz Arm® Cortex®-M4 with floating point unit
- Runs Bluetooth stack and applications
- Option to execute from on-chip flash or RAM
- Home automation
- Industrial
- Medical and Wellness
- Fitness trackers
AIROC™ Modules
Infineon's AIROC™ CYW20820 Bluetooth® & Bluetooth® LE modules are fully integrated with onboard crystal oscillator, passive components, flash memory, and the CYW20820 system on chip. These highly integrated modules are also globally certified to support fast time-to-market. The AIROC™ CYBT-243053-02, CYBT-253059-02 , CYBT-243068-02 are supported by the AIROC™ Bluetooth® SDK in ModusToolbox™ software and tools with code examples to support rapid development of embedded Bluetooth® LE applications.
Bluetooth® 5.2 core spec compliant with LE 2 Mbps
- Supports Basic Rate, Enhanced Data Rate, and Bluetooth® Low Energy
- -94.5dBm Rx sensitivity
- 11.5 dBm Tx LE, 11.5dbM Tx BR, and 2.5 dbM Tx EDR
- 176KB RAM and 256 KB flash memory optimized for data transfer use cases
- 96 MHz Arm Cortex-M4 with floating point unit
- Runs Bluetooth® stack and applications
- Option to execute from on-chip flash or RAM
Flexible and easy to use Bluetooth® SDK
- Code examples for LE: Hello Sensor, Hello Client, Beacon, Alert Notification Profile (ANC, ANS), Battery Profile (BAS, BAC), and Heart Rate Profile (HRC, HRS)
- RFCOMM code examples: map, spp, spp multi port
- HAL code examples: adc, puart, pwm, gpio, i2c_master, low_power
Package
- 62-ball BGA (4.5mm x 4.5 mm)
AIROC™ CYBT-243053-02 Bluetooth® and Bluetooth® LE module
- Qualification and Certification
- Bluetooth® SIG QDID1, FCC, CE, MIC2 and ISED3
- Small Footprint
- 12 mm x 16.61 mm x 1.7 mm, 35-pad SMT with 22 GPIO
- Bluetooth® 5.0
- Max Tx output power: +10.5 dBm
- Bluetooth® SIG Mesh Supported
- Highly Integrated Solution
- Crystal, 256KB flash, PCB antenna
- Wire Global Coexistence Interface (GCI)
- Simultaneous multiple Master and Slave
- Secure over-the-air (OTA) firmware upgrade
- Pre-programmed with EZ-Serial firmware
AIROC™ EVALUATION KIT
CYW920820M2EVB-01
The Infineon CYW920820M2EVB-01 Evaluation kit enables you to evaluate and develop single-chip Bluetooth® applications using the AIROC™ CYW20820, an ultra-low-power Bluetooth® & Bluetooth® LE system on a chip.
Kit features
- AIROC™ CYW20820 Bluetooth® and Bluetooth® LE system on chip in 62 pin FPBGA package
- Arduino compatible headers for hardware expansion
- On-board sensors – an ambient light sensor, thermistor, and Infineon digital microphone
- User switches and LEDs
- USB connector for power, programming and USB-UART bridge
- Base Board - CYW9BTM2BASE1
- CYW920820M2IPA1 Bluetooth® Module Evaluation Board (mounted onto baseboard)
- USB Standard-A to Micro-B cable
AIROC™ BLUETOOTH AND BLUETOOTH LE SOC
AIROC™ BLUETOOTH AND BLUETOOTH LE SOC
CYW20820A1KFBGT
The CYW20820 is a Bluetooth® 5.2 core spec compliant single-chip solution targeted for Internet of Things (IoT) applications. The CYW20820 is a highly integrated device which delivers up to 11.5 dBm transmit output power in LE and BR modes and up to 2.5 dBm in EDR mode, allowing device makers to reduce product footprints and decrease overall system costs associated with implementing Bluetooth® solutions.
Buy nowQuick start guideApplication Notes
AIROC™ BLUETOOTH AND LE EVALUATION KIT
CYW920820M2EVB-01
The Infineon AIROC™ CYBT-243053-02 Bluetooth® & Bluetooth® LE 5.0 Module Evaluation Kit (CYBT-243053-EVAL) enables evaluation, prototyping, and development of a wide array of IoT applications using the AIROC™ CYBT-243053-02 module, which is based on CYW20820 system on a chip.
Kit features
- An evaluation board that can support various Bluetooth protocols including Generic Access Profile (GAP), Generic Attribute Profile (GATT), Security Manager Protocol (SMP), Radio Frequency Communication protocol (RFCOMM), Service Discovery Protocol (SDP), and BLE Mesh protocol
- Evaluation board with integrated serial flash
- Input/output interfaces for communications and programming
- Various sensors like the light sensor, thermistor and LEDs
- External headers for debugging and connectivity
- Interfaces to USB power or to a coin cell
- PCB Antenna and PA/LNA
- 24MHz crystal oscillator
AIROC™ CYW243053 & CYW243059 Modules
AIROC™ BLUETOOTH AND BLUETOOTH LE MODULE
CYBT-243053-02
Infineon’s AIROC™ CYBT-243053-02 is a fully certified Bluetooth® and Bluetooth® LE module based on Infineon’s CYW20820. This embedded module is available as a 35-ball package in 12x16.61x1.7mm SMT form-factor.
Buy nowData sheetAIROC™ BLUETOOTH AND BLUETOOTH LE MODULE
CYBT-253059-02
The CYBT-253059-02 supports a number of peripheral functions (ADC, PWM), as well as multiple serial communication protocols (UART, SPI, I2C, I2S/PCM). CYBT-253059-02 includes a royalty-free stack compatible with Bluetooth 5.0 in a small 11.0 ×11.00 × 1.70 mm module form-factor.
Buy nowData sheetBlock diagram
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